Evolution of structural, surfacial and mechanical properties of titanium – nickel – copper thin fi lms during rapid thermal annealin
The structural, surfacial and nanoscale mechanical properties evolution of Ti–Ni–Cu thin films, prepared by the co-sputtering of TiNi and Cu targets during rapid thermal annealing (RTA) were investigated. Crystallization took place in a few seconds at 480 °C. With increasing annealing time (up to 180 s), roughness increased dramatically, and was far more prominent than in films […]
